Single-layer copper particles integrated with a carbon nanotube film for flexible electromagnetic interference shielding

Abstract

The use of light and flexible electromagnetic interference (EMI) shielding materials, particularly those that can be processed into films, is crucial in managing the radiation pollution caused by modern electronic devices. However, the limited flexibility, weight, and thickness of the currently available shields constrain their practical applications. Herein, we demonstrate the potential of single-layer copper particles integrated with a carbon nanotube (CNT) film made from compressed CNT macroscopic tube (CCT) for EMI shielding. The single-layer copper particles infiltrated into the CCT film (CCTF), thereby mitigating the delamination of the CCTF-Cu interface and resulting in lightweight and excellent flexibility. The obtained film also exhibited a significantly increased EMI shielding effectiveness (SE) of 84 dB within a broad frequency range of 2.6–26.5 GHz. Consequently, an extremely high unit mass SE of 151724.1 dB g⁻¹ and unit volume SE of 17973.9 dB cm⁻³ were achieved. The values were approximately three times higher than that of the highest performance as previously reported. These findings were primarily attributed to their integrated architecture that causes most of the survival waves reflected and absorbed by their interior. Overall, these films can potentially solve some of the most critical problems of wearable and portable electronic devices.