Issue 22, 2023

Flexible and temperature-responsive hydrogel dressing for real-time and remote wound healing monitoring

Abstract

Wound management is highly clinically desirable due to the complexity and diversity of the wound repair process. However, it is still a major clinical challenge to develop a wound dressing with the capabilities of real-time and remote monitoring during wound healing. Herein, we have designed a polymer-based wound dressing in the form of a conductive, soft, temperature-responsive, antibacterial and biocompatible hydrogel, which is composed of polyacrylic acid (PAA)-grafted poly(N-isopropylacrylamide) (PNIPAM), vinyl-based polyacrylamide (PAM) and silver nanowires (AgNWs). In this hydrogel dressing, PAA-grafted PNIPAM acts as conformal interface and intrinsic temperature-responsive matrix, PAM helps to construct semi-penetrating polymer networks (SIPNs) to improve the mechanical properties, while the AgNWs introduce a three-dimensional conductive hydrogel network with antibacterial properties and sensing properties. The constructed hydrogel matrix was connected to a Bluetooth module to transmit the temperature changes wirelessly to a smart device. The design integrating a conductive hydrogel dressing with a wireless transmission module realized the real-time and wireless monitoring of the wound temperature, which is helpful to provide an early diagnosis of infection. This proof-of-concept study is highly promising in the development of new strategies to significantly improve wound management and other pathological diagnostics or treatments.

Graphical abstract: Flexible and temperature-responsive hydrogel dressing for real-time and remote wound healing monitoring

Supplementary files

Article information

Article type
Paper
Submitted
16 Jan 2023
Accepted
04 May 2023
First published
04 May 2023

J. Mater. Chem. B, 2023,11, 4934-4945

Flexible and temperature-responsive hydrogel dressing for real-time and remote wound healing monitoring

J. Jiang, J. Ding, X. Wu, M. Zeng, Y. Tian, K. Wu, D. Wei, J. Sun, Z. Guo and H. Fan, J. Mater. Chem. B, 2023, 11, 4934 DOI: 10.1039/D3TB00099K

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