Issue 7, 2011

Adhesive lithography for fabricating organic electronic and optoelectronics devices

Abstract

Improvements in organic electronic materials have led to novel device applications, ranging from large-area flexible displays to lightweight plastic electronics. Progress on these applications would benefit from development of low-cost fabrication techniques for organic semiconductors. In this review, several fabrication processes based on adhesion force (i.e. van der Waals forces, thiol–metal reactions, and cold welding) are introduced. These patterning techniques are dry patterning techniques, i.e., the electronic materials are patterned from the raised regions of molds onto a substrate directly by additive or subtractive patterning methods. Patterning of organic small molecule, polymer thin films and metal electrodes by adhesive lithography is demonstrated. The operating properties of patterned organic light-emitting diodes (OLEDs) and organic thin film transistors (OTFTs) are comparable with the performance of devices fabricated by conventional evaporation deposition methods.

Graphical abstract: Adhesive lithography for fabricating organic electronic and optoelectronics devices

  • This article is part of the themed collection: Lithography

Article information

Article type
Review Article
Submitted
12 Jan 2011
Accepted
03 May 2011
First published
22 Jun 2011

Nanoscale, 2011,3, 2663-2678

Adhesive lithography for fabricating organic electronic and optoelectronics devices

Z. Wang, R. Xing, X. Yu and Y. Han, Nanoscale, 2011, 3, 2663 DOI: 10.1039/C1NR10039D

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