Issue 4, 2004

Controlled growth and subsequent chemical modification of poly(glycidyl methacrylate) brushes on silicon wafers

Abstract

The controlled growth of poly(glycidyl methacrylate) (PGMA) and poly(GMA-co-MMA) brushes by atom transfer radical polymerization (ATRP) in methanol/water has been demonstrated on silicon wafer surfaces. A polymerization system using copper(I) bromide, copper(II) chloride and 2,2′-dipyridyl was found to produce a nearly linear rate of growth for times of up to 4 h, giving brushes of up to 120 nm thickness. Reinitiation of these brushes to grow further PGMA demonstrated the living nature of the polymerization system. A trichlorosilane-functional initiator was used, and it was found that brushes grown from initiator layers deposited in the presence of a small amount of triethylamine were less rough and showed more linear growth with time. The reaction of the pendant epoxide group of these brushes with octylamine from solution was demonstrated.

Graphical abstract: Controlled growth and subsequent chemical modification of poly(glycidyl methacrylate) brushes on silicon wafers

Article information

Article type
Paper
Submitted
07 Oct 2003
Accepted
19 Nov 2003
First published
12 Jan 2004

J. Mater. Chem., 2004,14, 730-734

Controlled growth and subsequent chemical modification of poly(glycidyl methacrylate) brushes on silicon wafers

S. Edmondson and W. T. S. Huck, J. Mater. Chem., 2004, 14, 730 DOI: 10.1039/B312513K

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