Issue 7, 2007

Atomic layer deposition of polyimide thin films

Abstract

The atomic layer deposition (ALD) of different polyimide thin films has been studied. We have demonstrated self-limiting ALD deposition of PMDA–DAH, PMDA–EDA, PMDA–ODA and PMDA–PDA thin films at 160 °C. The maximum deposition rate of 5.8 Å cycle−1 was obtained for the PMDA–DAH process. Although the deposition rate was high at 160 °C, a sudden decrease was observed when the temperature was increased. Regardless of the process studied, no film growth was obtained at 200 °C or above. Deposited polyimide films were analysed by FTIR, AFM and TOF-ERDA. According to the FTIR measurements, imide bonds were formed already in as-deposited films indicating polyimide formation without any additional thermal treatment.

Graphical abstract: Atomic layer deposition of polyimide thin films

Article information

Article type
Paper
Submitted
05 Sep 2006
Accepted
10 Nov 2006
First published
24 Nov 2006

J. Mater. Chem., 2007,17, 664-669

Atomic layer deposition of polyimide thin films

M. Putkonen, J. Harjuoja, T. Sajavaara and L. Niinistö, J. Mater. Chem., 2007, 17, 664 DOI: 10.1039/B612823H

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