Fabrication of low-cost submicron patterned polymeric replica mold with high elastic modulus over a large area
Abstract
Low cost submicron
Maintenance work is planned for Wednesday 1st May 2024 from 9:00am to 11:00am (BST).
During this time, the performance of our website may be affected - searches may run slowly and some pages may be temporarily unavailable. If this happens, please try refreshing your web browser or try waiting two to three minutes before trying again.
We apologise for any inconvenience this might cause and thank you for your patience.
* Corresponding authors
a
Electronic Paper Technology Research team, IT Component & Materials Research Division, Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon, Korea
E-mail:
jooyeon.kim@etri.re.kr
Fax: +82 42 860 5404
Tel: +82 42 860 6216
b
RFID/USN Device team, IT Convergence Technology Research Laboratory, Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon, Korea
Fax: +82 42 860 1457
Tel: +82 42 860 5776
Low cost submicron
J. Y. Kim, K. Park, Z. Kim, K. Baek and L. Do, Soft Matter, 2012, 8, 1184 DOI: 10.1039/C1SM06788E
To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.
If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.
If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.
Read more about how to correctly acknowledge RSC content.
Fetching data from CrossRef.
This may take some time to load.
Loading related content