Copper inks formed using short carbon chain organic Cu-precursors

Abstract

Cu-based printing inks (20 wt% Cu) and (9.6 wt% Cu) were prepared using the short carbon chain organic Cu-precursors formed during the preparation of the inks, which can easily form a favorable conductive film onto glass slides at 290 °C and 220 °C. The resistance of the film induced by the oxidation of Cu and the remainder of the long carbon chain Cu-precursors markedly decreased, more than usual. The factors influencing the formation and conductive mechanism of the copper ink and film are discussed.