Construction of molecular regular tessellations on a Cu(111) surface

Abstract

Three types of molecular regular tessellations, i.e., hexagonal, square and triangular tessellations, were constructed on Cu(111) by using 4,4′-dihydroxydiphenyl as the precursor through molecular assembly. These tessellations are stabilized by multiple intermolecular hydrogen bonds and the proportion of each tessellation can be tuned by thermal treatment.