Issue 42, 2018

A low temperature self-reducible copper hydroxide amino–alcohol complex catalyzed by formic acid for conductive copper films

Abstract

Copper hydroxide possesses a much higher copper content and lower price than other copper salts, however it decomposes to cupric oxide and water upon heating, restricting it as a self-reducible copper precursor. In this study, a novel self-reducible copper hydroxide complex with amino–alcohol is successfully developed. Copper hydroxide was converted to a self-reducible complex with 3-dimethylamino-1,2-propanediol (DMAPD), in which the copper ions could be reduced to elementary copper at suitable temperatures. Moreover, the addition of a small amount of formic acid can catalyze the self-reduction of the complex to copper completely. In particular, the self-reduction temperature could be reduced to about 130 °C and the sintered films exhibited good electrical conductivity. A possible cyclic reduction mechanism showing the catalytic effect of formic acid was proposed. This low temperature sintering self-reducible complex makes copper hydroxide a new potential copper source for the fabrication of conductive copper films.

Graphical abstract: A low temperature self-reducible copper hydroxide amino–alcohol complex catalyzed by formic acid for conductive copper films

Supplementary files

Article information

Article type
Paper
Submitted
31 May 2018
Accepted
23 Sep 2018
First published
25 Sep 2018

J. Mater. Chem. C, 2018,6, 11320-11327

A low temperature self-reducible copper hydroxide amino–alcohol complex catalyzed by formic acid for conductive copper films

T. Qi, Z. Zhang, Y. Li, J. Wang and F. Xiao, J. Mater. Chem. C, 2018, 6, 11320 DOI: 10.1039/C8TC02665C

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