Issue 16, 2019

Dynamic Ag+-intercalation with AgSnSe2 nano-precipitates in Cl-doped polycrystalline SnSe2 toward ultra-high thermoelectric performance

Abstract

Recently, thermoelectric lead-free selenides have attracted great attention due to their earth-abundant, low-cost and environment-friendly characteristics. Here we report a new strategy to simultaneously enhance the electronic transport properties and reduce the thermal conductivity of polycrystalline SnSe2. By combining weak van der Waals bonding with the mobile behavior of Ag+ ions, the carrier concentration is optimized over a wide temperature range, which can be attributed to the dynamic Ag+-intercalation into the van der Waals gap from the Ag+ ion reservoir AgSnSe2. On account of additional electrical bridges between interlayers contributed by the intercalated Ag+ ions and weak anisotropy, an exciting high power factor of up to ∼7.46 μW cm−1 K−2 at 789 K is achieved along the pressing direction. In addition, the thermal conductivity is simultaneously reduced to ∼0.57 W m−1 K−1 at 789 K, owing to numerous line defects, phase interfaces, twin boundaries, dislocations and intercalated atomic layers generated after Ag introduction, as well as the anharmonic vibration of Ag+ ions. As a result, a record peak ZT of ∼1.03 at 789 K is realized along the pressing direction, which is ∼1.6 times larger than the highest reported value (0.63) of polycrystalline SnSe2 and even comparable to that of p-type polycrystalline SnSe. This study opens a new way to achieve ultra-high thermoelectric performance, especially in layered materials.

Graphical abstract: Dynamic Ag+-intercalation with AgSnSe2 nano-precipitates in Cl-doped polycrystalline SnSe2 toward ultra-high thermoelectric performance

Supplementary files

Article information

Article type
Paper
Submitted
14 Feb 2019
Accepted
18 Mar 2019
First published
18 Mar 2019

J. Mater. Chem. A, 2019,7, 9761-9772

Dynamic Ag+-intercalation with AgSnSe2 nano-precipitates in Cl-doped polycrystalline SnSe2 toward ultra-high thermoelectric performance

C. Liu, Z. Huang, D. Wang, X. Wang, L. Miao, X. Wang, S. Wu, N. Toyama, T. Asaka, J. Chen, E. Nishibori and L. Zhao, J. Mater. Chem. A, 2019, 7, 9761 DOI: 10.1039/C9TA01678C

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