Issue 19, 2024

Schottky barrier reduction on optoelectronic responses in heavy ion irradiated WSe2 memtransistors

Abstract

Two-dimensional transition metal dichalcogenide-based memtransistors provide simulation, sensing, and storage capabilities for applications in a remotely operated aerospace environment. Swift heavy ion (SHI) irradiation technology is a common method to simulate the influences of radiation ions on electronic devices in space environments. Here, SHI irradiation technology under different conditions was utilized to produce complex defects in WSe2-based memtransistors. Low-resistance state to low-resistance state (LRS–LRS) switching behaviors under light illumination were achieved and photocurrent responses with different spike trains were observed in SHI-irradiated memtransistors, which facilitated the design of devices with enriched analog functions. Reduction of the Schottky barrier height due to the introduced defects at the metal/WSe2 interface was confirmed to be the major factor responsible for the observed behaviors. 1T phase and concentric circle-type vacancies were also created in the SHI-irradiated 2H-WSe2 channel besides the amorphous structure; these complex defects could seriously affect the transport properties of the devices. We believe that this work serves as a foundation for aerospace radiation applications of all-in-one devices. It also opens a new application field of heavy ion irradiation technology for the development of multiterminal memtransistor-based optoelectronic artificial synapses for neuromorphic computing.

Graphical abstract: Schottky barrier reduction on optoelectronic responses in heavy ion irradiated WSe2 memtransistors

Supplementary files

Article information

Article type
Paper
Submitted
02 Jan 2024
Accepted
07 Apr 2024
First published
09 Apr 2024

Nanoscale, 2024,16, 9476-9487

Schottky barrier reduction on optoelectronic responses in heavy ion irradiated WSe2 memtransistors

S. Zhang, L. Xu, S. Gao, P. Hu, J. Liu, J. Zeng, Z. Li, P. Zhai, L. Liu, L. Cai and J. Liu, Nanoscale, 2024, 16, 9476 DOI: 10.1039/D4NR00011K

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